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Technical Data Sheet: Hon Panel

It can be understood that the thermal conductivity is lower than that of calcium silicate boards, indicating high insulation performance!

This document is a technical data sheet introducing the thermal insulation performance of honpanels. The explanation of terms provides a clear overview of thermal conductivity (λ value) and thermal transmittance (U value). Additionally, the thermal insulation performance of various backing materials is illustrated with examples of thermal conductivity for different materials and their thermal transmittance for various thicknesses. [Contents] ■ Explanation of terms ■ Thermal insulation performance of various backing materials *For more details, please refer to the PDF document or feel free to contact us.

  • Bead method polystyrene foam

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